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New Leak Suggests Samsung’s Upcoming Foldables Are Water-Resistant

The Galaxy Z Flip and Fold over water droplets.
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Foldable phones are known for their fragility, but Samsung may add water resistance to its upcoming Galaxy Z Flip 3 and Z Fold 3. In fact, a new leak from Evan Blass suggests that the phones will feature an IPX8 rating, meaning that they can be fully submerged in water without taking any damage—how is that possible?

If Evan Blass’ leak is accurate, then Samsung must have the best engineers in the world. Foldable displays have a lot of slack to prevent creasing, so it’s very easy for moisture (and small particles) to slip behind their screen. Not only that, but hinge mechanisms can be very fragile and aren’t exactly meant to be submerged.

https://twitter.com/evleaks/status/1419674682543034370

While it’s very unlikely, it’s possible that Samsung has finally found a way to make a durable, reliable foldable device. That could explain why Samsung isn’t releasing a Note device this year and is instead adding S Pen support and a high-end processor to its foldables.

Also included in Evan Blass’ leak are some display and camera specs. The Z Flip 3 supposedly has a 6.7-inch internal display and a 1.9-inch cover screen for notifications, while the Fold 3 has a 7.6-inch outer screen and a 12.4-inch inner “tablet” display. Camera-wise, both devices have a 12MP main camera and 10MP selfie lens, though the Z Fold has a tri-camera array while the Z Flip has just two outer lenses.

We’ll learn more about the Samsung Galaxy Z Fold 3 and Z Flip 3 when they’re formally announced on August 11th. Hopefully Evan Blass’ leak is correct, though an IPX8 water-resistance rating seems a little too good to be true, as it would require a massive leap in engineering. Hey, at least we know the S Pen rumor is true.

Source: Evan Blass via The Verge

Andrew Heinzman Andrew Heinzman
Andrew is the News Editor for Review Geek, where he covers breaking stories and manages the news team. He joined Life Savvy Media as a freelance writer in 2018 and has experience in a number of topics, including mobile hardware, audio, and IoT. Read Full Bio »